Milpitas, Calif., April 26, 2012 – GLOBALFOUNDRIES today announced a significant milestone on the road to enabling 3D stacking of chips for next-generation mobile and consumer applications. At its Fab ...

The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.

One of the core innovations is that Broadcom uses face-to-face 3D chip-stacking technology based on hybrid bonding, which connects the pillars of copper wiring on the front of each silicon die ...

a new 3D chip integrating a commercial DRAM chip on top of a logic IC. The new 3D stack resembles as close as possible to future commercial chips. It consists of a 25µm thick logic die on top of which ...

In this context, a joint research team from South Korea and the United States has developed a new 3D semiconductor integration technology that can vertically stack chips. Professor Kim Ji-hwan ...