Today's high-end processors, especially those powering data centers and AI workloads, already rely on multi-chiplet designs ...

As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking ...

Samsung’s V-NAND [image source] While the idea of 3D chips constructed out of multiple layers of silicon is an old idea, only recently have we seen this sort of technology make it into consumer ...

Atum Works claims its nanoscale 3D printing technology can cut chip production costs by 90% by replacing traditional ...

Semiconductor chips have traditionally been manufactured in two dimensions. But as devices become more powerful and compact, ...

There are two versions of the MCU, the S6J324C series enables 2D graphics while the S6J326C variant supports both 2D and 3D graphics. Both include CAN-FD and Ethernet AVB, as well as advanced graphics ...

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies Also announce tool certification for TSMC N3C process and initial ...