However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] video about his techniques for soldering BGA and inspecting that you managed to do it right.

As long as one uses caution and the proper equipment, though, this could also be a useful device for home GPU solder reflow/repair or the reflowing of other BGA (ball grid array) chips.

With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).

It is generally agreed that, on average, 40% to 60% of the defects generated by a surface mount production line can ...

The Reverse Hybrid process utilizes SAC (Sn-Ag-Cu) solder paste and BGA components with LTS (Low Temperature Solder) balls. Using a SAC reflow profile, this innovative method forms homogeneous ...

Mike Dube, Executive Vice President of Manufacturing Operations & Engineering, Rochester Electronics ...

From there, some general soldering tools like flux and solder wick, a stencil for your chip, BGA balls, and a $20 USB-C hotplate are instrumental for reballing chips – tools you ought to have.