The Bosch process offers higher etch rates but at the cost of sidewall roughness. To limit this roughness the rates are usually in the range of 10-20µm, which is still higher then the cryo process. To ...

The amount of notching versus duty cycle is shown in figure 9 for different trench sizes. The Bosch process offers higher etch rates but at the cost of sidewall roughness. To limit this roughness the ...

The researcher came up with two ways to improve the profile of the trenches in the so-called Bosch process. During this process, a polymer layer ensures that the sidewalls are not etched by the ...

However, the Bosch DRIE process has rarely been used to construct nanostructures because the well-known effect of sidewall rippling, or so-called 'scalloping', is intolerably prominent on the ...