Breaking complex chips into smaller pieces allows for much more customization, particularly for domain-specific applications, ...

Rigorous testing is still required, but an abstraction layer can significantly reduce errors in the fab while optimizing ...

GlobalFoundries on Tuesday forecast first-quarter revenue and profit below Wall Street estimates as the contract chipmaker ...

This 3D chip-stacking approach vertically stacks the chips, which enhances thermal management and reduces electrical leakage compared to traditional 2D designs. Apple is said to have expanded its ...

One of the core innovations is that Broadcom uses face-to-face 3D chip-stacking technology based on hybrid bonding, which connects the pillars of copper wiring on the front of each silicon die ...

The M5 chips are expected to bring improvements through advanced 3-nanometer technology, enhancing speed and efficiency.

Global collaboration, not nationalism, key to chip innovation, says imec CEO South Korea has achieved remarkable growth over ...