ChEmpower Corp., a semiconductor materials company providing polish pads and chemical solutions, today announced it has ...

However, if someone wants to use GaAs transistors for cooling traditional chips (or rather chiplets), they can use heterogeneous 3D integration or wafer bonding, which are well-known techniques ...

In a traditional chip with all frontside metallization ... Overcoming the process challenges involves extreme wafer thinning, wafer bonding, aligning frontside to backside interconnects, and learning ...

The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs.

A leaker is detailing the new A20 chip, expected to be available with the iPhone 18. Here's why it will be another major breakthrough tech.

Applied Materials, Inc. has made a strategic move in the semiconductor industry by purchasing a 9% stake in BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment. This ...

Applied and Besi have extended their agreement, to co-develop the industry’s first fully integrated equipment solution for ...