It contains full functional HBM3 Controller and PHY IP and vendor’s HBM3 memory using TSMC’s industry leading CoWoS® technology. HBM memory vendors keep aggressive roadmap increasing throughput and ...
The platform was demonstrated at the Partner Pavilion of the TSMC 2022 North America Technology Symposium; it contained an HBM3 Controller, a PHY, GLink-2.5D die-to-die interface, and a 112G SerDes.
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