Tom's Hardware on MSN3d
Nvidia’s new silicon photonics-based 400 Tb/s switch platforms enable clusters with millions of GPUs
Nvidia teams up with TSMC for its first silicon photonics networking gear platforms that will open doors to datacenters with ...
DIGITIMES8d
GUC announces successful launch of industry's first 32G UCIe silicon on TSMC 3nm and CoWoS technology
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal ...
A20 Chip for iPhones Said to Remain 3nm [Retracted Rumor]
While the iPhone 17 series is still around six months away, a rumor pertaining to next year's iPhone 18 series has already ...
PhoneArena3d
Apple expected to make unusual decision about the A20 chips powering 2026's iPhone 18 line
Apple might stick to using TSMC's third-generation process node (N3P) for the A20 chips powering the iPhone 18 in 2026.
Design-Reuse3y
GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS Technology Validating 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and 112G-LR SerDes IPs
said Igor Elkanovich, CTO of GUC. “We used our multi-lane 112Gbps package design expertise together with silicon-correlated high-speed interposer design flow to validate 112Gbps over the latest CoWoS ...
Design-Reuse3y
GUC Announces 2.5D and 3D Multi-Die APT Platform for AI, HPC, Networking ASICs
The platform supports TSMC's CoWoS-S, CoWoS-R, and InFO technologies. GUC provides a total solution: silicon-proven interface IPs, CoWoS® and InFO silicon-correlated design, signal and power integrity ...