Supply chain sources indicate that TSMC's CoWoS capacity target for 2025 has been slightly adjusted downward, however, it is expected to rise consistently with the addition of new capacity in the ...
The 200 series, which includes the GB200 NVL72 and HGX B200, features a dual-die design and is manufactured using CoWoS-L. The 300 series, which includes the GB300 NVL72 and HGX B300 NVL16, use ...
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Amkor and TSMC team up for advanced packaging in the U.S. — CoWoS and InFo to make AI and HPC CPUsHowever, the collaboration between TSMC and Amkor will be more profound as the latter intends to offer TSMC’s CoWoS and InFo advanced packaging technologies for high-end AI, HPC, and mobile ...
More than 70% of TSMC’s CoWoS-L advanced packaging capacity has already been booked, fueled by strong demand for Nvidia’s Blackwell GPUs. This surge is also driving orders to major backend ...
The platform supports both the TSMC CoWoS-S (silicon Interposer) and the CoWoS-R (organic interposer) advanced packaging technologies. The platform represents real-world CPU/GPU/AI/Networking chips by ...
Hsinchu, Taiwan – June 8, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS® Platform with 7.2 Gbps HBM3 ...
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