A process of Nickel–Tungsten–Silicon Carbide plating was developed as an alternative to hard chrome plating. This new plating process has superior abrasion resistance and several advantages over hard ...

THE work under notice has been written mainly to help those employed in the industry to understand and apply results which have been obtained in research laboratories. The authors have taken a leading ...

AT a meeting of the Royal Society of Arts on February 2, a paper by Mr. A. Rosenberg was read upon an improved method of electroplating. Mr. Rosenberg dispenses altogether with the plating bath and ...

Applied Materials, Inc. introduces its 300mm SlimCell(TM) electrochemical plating (ECP) system that overcomes the limitations of existing plating technology to deliver a cost-effective, ...

Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...