BANGALORE, India, April 11, 2025 /PRNewswire/ -- Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image ...

Applied Materials, Inc. has made a strategic move in the semiconductor industry by purchasing a 9% stake in BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment. This ...

Applied Materials has purchased nine percent of the outstanding shares of the common stock of BE Semiconductor Industries N.V ...

There are currently three ways of Cu-Cu hybrid bonding (see the benchmarking table below). Wafer to Wafer (W2W) process is the most commonly used, whereas die-to-wafer (D2W) or chip to wafer (C2W) ...

In a press release, Applied Materials announced it had acquired a 9% stake in Dutch semiconductor assembly equipment maker BE ...

“Hybrid bonding is central to the next generation of high-density interposer technology,” says a UMC spokesperson. “Achieving stable, uniform bonds at the wafer or substrate level is paramount.

Other leading makers of 3D NAND memory — including Kioxia/Sandisk and YMTC — also produce 3D NAND array and periphery on different wafers and then bond them together. Such an architecture ...

The EV Group (EVG), a provider of process solutions for semiconductor designs and chip integration schemes, has unveiled the next-generation version of its GEMINI automated production wafer bonding ...