Advanced packaging is inevitable. Large systems companies and processing vendors already are working with various types of ...

The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...

The consequences of the US BIS whitelist transfer have led to a surge in orders from China-based IC design firms, which will enhance the sales performance of associated Taiwan-based OSATs ...