EV Group unveils new version of its GEMINI automated production wafer bonding system supporting MEMs advancements.

EV Group, an Austria-based supplier of equipment and process solutions for semiconductors, showed the next-generation version ...

Around that time, another technology that was emerging rapidly was microelectromechanical systems (MEMS) — tiny sensors and actuators fabricated from silicon wafers using thin-film processing ...

presents the achievement in 3D/2.5D MEMS probe card development for WAT test (Wafer Acceptance Test, WAT) and provides users the positive effects on test efficiency and reliable results.

EVG has already delivered several GEMINI systems built on the new equipment platform to multiple leading MEMS manufacturers. EVG GEMINI 300-mm high-force automated production wafer bonding system.