Consumers' escalating demand for more features in their small and mobile electronics products, such as PDAs and cell phones, is driving a need for smaller feature sizes, process geometries, and pc ...

In the production of printed circuit boards (PCBs), micrometer-diameter vias – known as microvias – are drilled through multilayer PCBs. Lasers can drill through these structures with high throughput ...

At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, Georgia Institute of Technology, Tokyo Ohka Kogyo (TOK) and Panasonic presented a paper on a technology that ...

Miniaturisation is no longer a trend — it’s a design necessity. As standard PCB technologies reach their limits, the transition to HDI and microvia designs becomes essential for integrating fine-pitch ...