Additionally, new features compensate for PCB warpage and support automatic stability control of the image sequence. GOEPEL reports that a true to height reconstruction of PCB layers in which ...

Warpage results from a DIC. When the BGA is soldered to a printed circuit board (PCB) it can warp during reflow. This could result in solder defects, such as head-in-pillow (HiP), that can reduce ...

Insufficient cross-linking of the PCB substrate, for example, only becomes noticeable as PCB warpage after soldering. However, the consequences are serious for the quality and lifetime of the complete ...

The warpage measurements on printed circuit board (PCB), interposer and chiplet samples, during heating and subsequent cooling, were employed for calibrating the model parameters. The warpage ...