The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...
ACM’s Ultra ECP ap-p enables next generation device performance amid accelerating market demand for advanced packaging SEMICON EUROPA, Munich, ...
On , Taiyo Holdings Co., Ltd. (Securities Code: 4626; hereinafter referred to as "Taiyo Holdings"), based in Tokyo, presented a paper, co-authored with imec, one of the world's largest semiconductor ...
Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia 2023 on May 23-25 in ...
Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...
Nordson MARCH Addresses the Ways Plasma Treatment during Fan-out Wafer and Fan-out Panel-Level Semiconductor Packaging Maximizes Performance and Optimizes Costs In recent years, there has been an ...
For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.
IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results
Feedback