Instead of convenient pins, BGA parts have tiny metallic balls on which solder is applied, a board is thrown through a reflow oven, and hopefully at the end, everything works. Sometimes these ...

It doesn’t help they’re not often upgradeable, so you’re stuck with what you’ve bought – unless, say, you’re a hacker equipped some tools for PCB reflow ... tool is a BGA rework ...

Voiding Voiding occurs in components such as BGA, SGA, QFN, and LGA and increase with a higher reflow temperatures and greater surface tension with lead free alloy. Voiding is affected by the ...