Until now, GPUs such as those from AMD and Nvidia have consisted of several chiplets located next to each other on a silicon interposer. Fast memory modules of the high-bandwidth memory (HBM ...

Preliminary silicon configurations allege two clusters ... fledged motherboards but appear to be some form of a specialized interposer to test voltage regulation for the upcoming platform.

The main R&D theme of this project is to develop cryogenic circuit and implementation techniques for large-scale silicon quantum computers ... qubit chips and their interface functionality on an ...

H-Cube' applies advanced silicon interposer technology and hybrid-substrate structure, allowing efficient integration of 6 HBMs, as well as lower cost benefit SEOUL, Korea -- November 11, 2021-- ...

IGAD2DY01A is a high speed die-to-die interface PHY which transmits data through TSMC advanced packaging solutions：Integrated Fan-Out (InFO) with RDL interconnect and Chip-on-Wafer-on-Substrate ...