Over the wide range of applications related to adhesives, one of the toughest challenges is bonding together substrates with different coefficients of thermal expansion (CTE). Furthermore, thermal ...

resulting in weaker bonding and lower thermal conductivity 9. Our first-principles calculations show that there are more reasons for the low thermal conductivities of IV–VI materials than that ...

Overall, the proposed research project seeks to provide new insight into the: (1) role of biochemical and physical alterations of ECM structural proteins on the sealed bond strength; (2) specific ...

It can be used for pre-packaging, reworked when using non-adhesives, and enables thermal bonding of two substrates at room temperature." "Oftentimes work at the nanoscale is foundational for a ...

Thermal expansion can be determined by applying the ISO 11359-2 test standard. When temperatures increase, most materials tend to expand, causing a change in material dimensions. When two ...