At its North American Technology Symposium, it introduced its next-generation system-on-wafer platform—CoW-SoW—that will enable 3D integration with wafer-scale designs. This builds on the InFO ...

Atlant 3D has raised $15 million as demand grows for its manufacturing system that builds materials and devices atom by atom.

and its Direct Wafer process enables the production of thinner 3D wafers by reducing the amount of silicon used to less than 1.5 g/W without compromising quality. The company said its production ...

The key processes—EIC/PIC 3D integration and fiber assembly—will be discussed in detail later. For the integration of EIC and PIC, chip-on-wafer 3D stacking is an effective method to minimize the ...