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TSMC to go 3D with wafer-sized processors — CoW-SoW technology allows 3D stacking for the world's largest chips
At its North American Technology Symposium, it introduced its next-generation system-on-wafer platform—CoW-SoW—that will enable 3D integration with wafer-scale designs. This builds on the InFO ...
pv magazine International6y
1366 Technologies and Hanwha Q Cells to open wafer factory in Malaysia
and its Direct Wafer process enables the production of thinner 3D wafers by reducing the amount of silicon used to less than 1.5 g/W without compromising quality. The company said its production ...
Semiconductor Engineering25d
Advanced Packaging Evolution: Chiplet And Silicon Photonics-CPO
The key processes—EIC/PIC 3D integration and fiber assembly—will be discussed in detail later. For the integration of EIC and PIC, chip-on-wafer 3D stacking is an effective method to minimize the ...