Publication citation: C. -H. Lai, W. -J. Yin, W. -H. Lai, C. -L. Kao, C. -C. Wang and C. Hung, “Fine-Line RDL Structure Analysis of Fan-Out Chip-on-Substrate Platform,” 2024 IEEE 26th Electronics ...

and high-density wafer-level RDL-based Integrated Fan-Out (InFO-R) designs. 3DIC Compiler provides packaging design solutions required by today's complex multi-die systems for applications like ...