Mature-node foundries in the US$56.3 billion market must evolve or risk deeper impact from Chinese price cuts.

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At this time, all participants are on a listen-only mode. A question-and-answer session will follow the formal presentation. ...

Rigetti Computing (NASDAQ: RGTI), a developer of quantum computing systems, went public by merging with a special purpose ...

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Standard NAND flash storage is used in microSD cards, USB drives, and solid-state drives in computers and phones. To fit more gigabytes into smaller spaces, manufacturers ...

This hybrid creation stacks up a whopping 16 layers of SanDisk's latest 3D NAND dies using tiny data pipelines called through-silicon vias. There's also a special ...

Future products include Zen 6 CCD and Halo APU with 3D stacking, and PlayStation 6 may ... but what we do know is that the UDNA chip will be made on TSMC's new N3E process node.

Researchers have designed a single-photon time-of-flight LiDAR system that can acquire a high-resolution 3D image of an object or scene up to 1 kilometer away. The new system could help enhance ...

The first was to develop a 3D integration technology compatible with legacy processes. 3D integration involves stacking chips vertically, which significantly improves integration density and ...