Rapid, localized heat management is essential for electronic devices and could have applications ranging from wearable materials to burn treatment. While so-called thermoelectric materials convert ...

Gamers waiting for new Zen 5 CPUs with AMD’s vaunted X3D cache will want to look at two chips that landed on Geekbench: the ...

Lam Research Corp. has rolled out what it claims is an advanced plasma conductor etch tool needed for 3D chipmaking. Called ...

To achieve ExaFLOPS computing power, it requires at least 1,000 AI chiplets interconnected by advanced high-density RDL ...

Powerchip’s Huang said they plan to reduce their work on display driver and sensor chips, which are largely used in the ...

Apple’s manufacturing partners have begun packaging the upcoming M5 chips, reports ETNews. Packaging is the process of wiring up the raw silicon die and placing it in a protective case.

He praised India’s advancements in AI, highlighting its achievements in building stacks, chips, models, and applications. Altman said, “Mostly, I’m seeing what people in India are building—the stack, ...

By stacking chips vertically through 3D integration and using innovative bonding techniques to reduce thickness and heat, companies aim to improve processing power and energy efficiency.

3D integration involves stacking chips vertically, which significantly improves integration density and miniaturization. However, electrical bonding between stacked chips typically requires ...

This dominant position has been reinforced by the company's comprehensive technology stack, which includes chips, servers, and software solutions. NVIDIA has demonstrated exceptional financial ...

3D integration involves stacking chips vertically, which significantly improves integration density and miniaturization. However, electrical bonding between stacked chips typically requires Through ...