MIT engineers have developed a method to seamlessly stack electronic layers to create faster, denser, more powerful computer chips. The team deposits semiconducting particles (in pink) as triangles ...

Their work, published in Nature Communications, can help to lower the cost of producing 2D semiconductor chips, enable 3D photonic and electronic chips, and may pave the way for other low-cost, ...

A Massachusetts semiconductor manufacturer plans to hire at its facility near Research Triangle Park, part of a $345 million expansion backed, in part, by a new federal grant. With days before an ...

Semiconductor firm to grow Triangle facility with new CHIPS grant awarded ahead of Trump By Brian Gordon. Updated March 6, 2025 10:45 AM.

Researchers can now fabricate a 3D chip with alternating layers of semiconducting material grown directly on top of each other. The method eliminates thick silicon substrates between the layers ...

Of course, building a new 3D Wi-Fi chip isn’t as easy as just making it happen. Researchers and engineers will need to figure out the best way to make the system work.

Researchers have invented a new way to align 3D semiconductor chips by shining a laser through concentric metalenses patterned on the chips to produce a hologram. Their work can help to lower the ...