From there, some general soldering tools like flux and solder wick, a stencil for your chip, BGA balls, and a $20 USB-C hotplate are instrumental for reballing chips – tools you ought to have.

Once he has the solder paste on, he places the components ... [Colin] uses a microscope to do some inspection of the board, although the BGA could have concealed faults that would be hard to ...

As long as one uses caution and the proper equipment, though, this could also be a useful device for home GPU solder reflow/repair or the reflowing of other BGA (ball grid array) chips.

With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).

It is generally agreed that, on average, 40% to 60% of the defects generated by a surface mount production line can ...

TopLine is a pioneer in CGA Solder Columns Technology and Low temperature cryogenic package-to-board interconnects. TopLine is also a supplier of Bonding Wire for many semiconductor uses and for EV ...

Mike Dube, Executive Vice President of Manufacturing Operations & Engineering, Rochester Electronics ...