TSMC is on track to qualify its ultra-large version of chip-on-wafer-on-substrate (CoWoS) packaging technology that will offer an interposer size of up to nine reticle sizes and 12 HBM4 memory ...

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Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system has now fully entered production, which will gradually enhance CoWoS-L ...

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

TSMC's CoWoS capacity expansion is expected to double again in 2025; commentary on plant progress would be a key focus point in Q4 FY24's earnings call. The next couple of quarters may see further ...

Nvidia's most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a ...

The CoWos-S is designed to meet the rigorous requirements of artificial intelligence chips. TSMC produces these for Nvidia and AMD ( AMD ). However, it has a high production cost.

As Nvidia ramps up production of its multi-chiplet Blackwell-series products, the company will use more CoWoS-L packaging capacity and less CoWoS-S packaging capacity, the company's chief ...

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP).