The spacing between adjacent pads is too close to cause bridging, too far away will lead to false soldering. Unreasonable ...
ACM’s Ultra ECP ap-p enables next generation device performance amid accelerating market demand for advanced packaging SEMICON EUROPA, Munich, ...
Using the mask-and-plate copper metallization technique, scientists at the German research center fabricated a 1.21 cm² perovskite–silicon tandem solar cell featuring a heterojunction bottom device.
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