PanelSemi signed a memorandum of understanding (MOU) with Japan Display (JDI) to collaborate extensively in advanced ceramic ...

Samsung Electronics is reportedly taking direct control of glass substrate supply chain development, a critical enabler for next-generation AI chips and high-performance computing. Industry ...

Competition for an early lead in glass substrates for computer chip manufacturing is heating up, with component firms projecting that the commercialization of this so-called "next-generation ...

That includes a four-star quarterback commit to Oregon, who USC is now attempting to flip. Jonas Williams showed ... competition from one university led by a former USC head coach.

Arizona cashed in more federal dollars than any state over the roughly two years since the CHIPS and Science Act ... university-led research, a highly competitive business environment, an already ...

Abstract: This paper studies the feasibility of direct flip-chip bonding of silicon carbide (SiC) chips onto alumina substrate for high-temperature applications up to 600℃. SiC dummy chips were ...