The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
InductEV and Skien Norway's ENRX have signed an MOU that seeks to establish technical standards and ensure compatibility ...
An eFPGA is an FPGA that’s embedded into an ASIC to provide one or more programmable-logic fabrics for flexibility and ...
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