However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] video about his techniques for soldering BGA and inspecting that you managed to do it right.

With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).

From there, some general soldering tools like flux and solder wick, a stencil for your chip, BGA balls, and a $20 USB-C hotplate are instrumental for reballing chips – tools you ought to have.