Indium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, ...

Ahead of opening tip, here's a look at the top players to watch at the TSSAA basketball state tournament this week. Arnett Hayes, BGA, Sr.: The Murray State football commit is averaging 16 points, ...

They are subject to the same quality control procedures and oversight that Bittele clients have come to expect - from Automated Optical Inspection (AOI) to X-ray inspection for BGA and QFN components, ...

Renesas has recently introduced the RA4L1 ultra-low-power Arm Cortex-M33 MCU family along with two evaluation/development boards. This new lineup consists of 14 ultra-low-power devices based on an 80 ...

Voiding Voiding occurs in components such as BGA, SGA, QFN, and LGA and increase with a higher reflow temperatures and greater surface tension with lead free alloy. Voiding is affected by the ...

0.6Gbps~4Gbps per lane 9bit/10bit parallel interface Implemented CTLE to compensate channel loss Integrated on-die termination resistors Tolerance frequency offset up ±15000ppm Build-in self-test ...

The JV will manufacture a wide range of products ranging from legacy packages such as QFN and QFP to advanced packages such as FC BGA, and FC CSP. The JV will cater to industries such as automotive, ...

Data supplied by Morningstar and accurate on Jun 30, 2024. It's not possible to publish a real-time Top 20 Shareholder list. Companies are not obliged to report this data (with the exception of ...

But a Twitter thread from [Greg Davill] will probably leave all but the most hardcore proponents of the art floundering, as he hand-wires a tiny FPGA in a BGA package to the back of a miniature ...

The future of tiny electronics is wearables, it seems, with companies coming out with tiny devices that are able to check your pulse, blood pressure, and temperature while relaying this data back ...