Once he has the solder paste on, he places the components ... [Colin] uses a microscope to do some inspection of the board, although the BGA could have concealed faults that would be hard to ...

However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] video about his techniques for soldering BGA and inspecting that you managed to do it right.

As long as one uses caution and the proper equipment, though, this could also be a useful device for home GPU solder reflow/repair or the reflowing of other BGA (ball grid array) chips.

With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).

It is generally agreed that, on average, 40% to 60% of the defects generated by a surface mount production line can ...

2. What are the defects of BGA production? There are various defects that a soldering job can present, even more so when the components that are being soldered are so closely packed as we have in the ...

This inspection checks the BGA soldering and so extracts 3D images of just the solder connection. Void inspection performance boosted by 3D X-Ray CT image processing Enhanced void inspections mitigate ...

The Reverse Hybrid process utilizes SAC (Sn-Ag-Cu) solder paste and BGA components with LTS (Low Temperature Solder) balls. Using a SAC reflow profile, this innovative method forms homogeneous ...