Reports indicate that the Trump administration is considering revising incentive agreements under the CHIPS and Science Act ...

ASML CEO signals US advantage as China faces 10~15 year gap in advanced chip technology. Christophe Fouquet, CEO of ASML, ...

We recently published a list of Top 11 AI News and Ratings You Should Take a Look At. In this article, we are going to take a look at where Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM ...

High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...

has unveiled the availability of the industry’s first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe™) Die-to-Die (D2D) IP subsystem, built on TSMC’s Chip-on-Wafer-on-Substrate ...

Phoenix Silicon International Corp (昇陽半導體), the world’s No. 2 supplier of reclaimed wafers, yesterday broke ground on a NT$2.5 billion (US$76.3 million) plant in Taichung as the company expands ...

Credit: Vendula - adobe.stock.com The latest PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbps while achieving industry-leading silicon area ...

That whole ideology, seen now, amounts to a kind of bargain: That in exchange for fealty to basic liberal causes, and support for the Democratic Party, Silicon Valley titans would be pretty much ...

Silicon Motion is working on its first PCIe 6.0 SSD controller known as SM8466. This controller is part of the MonTitan series aimed at datacenters and enterprise-level applications. Announced by ...

Image: REC Silicon The news that REC Silicon would be shutting down polysilicon production at its US manufacturing site in Moses Lake, Washington was an unpleasant New Years’ gift for much of ...

The CoWoS-S advanced packaging technology uses a single silicon interposer and through-silicon vias (TSVs) to facilitate the direct transmission of high-speed electrical signals between the die and ...