The relentless pursuit of higher performance and greater functionality has propelled the semiconductor industry through ...
Today’s high-speed PCB and system-level design demands fast, accurate simulation. This ebook explains how to choose the right ...
The spacing between adjacent pads is too close to cause bridging, too far away will lead to false soldering. Unreasonable ...
Bump scaling is pushing defect inspection to the limit. What comes next and why it matters.
MUNICH & SHENZHEN, China– (BUSINESS WIRE)–CELUS, the developer of a leading AI-assisted electronics design platform, and NextPCB, a globally recognized PCB manufacturing and assembly service provider, ...
True 3-D interconnects and packaging. Rigid PCBs are inherently 2-D. Rigid-flex, however, allows you to fold, bend and twist ...
School of Chemical Engineering and Technology, State Key Laboratory of Chemical Engineering, International Joint Laboratory of Low-carbon Chemical Engineering of Ministry of Education, Tianjin ...
Abstract: Deep learning has demonstrated promising efficacy in the localization of vertebrae within X-ray images, although it is recognized for its deficiencies in compositional generalization, data ...
Abstract: D advanced packaging is constantly developing in the direction of higher density wiring, and the vias structure of the interconnect line through the pins is unavoidable, and the uneven ...
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