PanelSemi signed a memorandum of understanding (MOU) with Japan Display (JDI) to collaborate extensively in advanced ceramic ...

Abstract: This paper studies the feasibility of direct flip-chip bonding of silicon carbide (SiC) chips onto alumina substrate for high-temperature applications up to 600℃. SiC dummy chips were ...

Hechizo, which makes ceramic light fixtures and jewelry, is slated to open a showroom early next month in part of its existing storefront in unit A of 1200 N. Arthur Ashe Blvd., around the corner from ...

Arizona cashed in more federal dollars than any state over the roughly two years since the CHIPS and Science Act ... university-led research, a highly competitive business environment, an already ...

Competition for an early lead in glass substrates for computer chip manufacturing is heating up, with component firms projecting that the commercialization of this so-called "next-generation ...

Nvidia Inc. NVDA, the artificial intelligence powerhouse led by Jensen Huang is pushing ... creating a less powerful chip for the Chinese market in 2022. The regulations, unveiled on Monday ...

today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC Compiler product for both silicon interposer based ...