The electronics industry is shifting to compact, powerful systems. Infineon supports this trend with new 650 V CoolSiC MOSFET families in Q-DPAK and TOLL packages, driving innovation at the system ...

Chiplet design engineers have complex new considerations compared to PCB concepts. Maintaining the quality and reliability of electrical signals as they travel through interconnects is proving to be ...

The Department of Energy is investing in next-gen microelectronics to curb skyrocketing energy demands. SLAC and other top institutions are developing innovative materials, AI-powered sensing, and ...

The TSC family has been designed to help customers achieve excellent robustness with maximum power density and system ...